公开(公告)号：US11493442B2

公开(公告)日：2022-11-08

申请号：US17251037

申请日：2019-05-29

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  3D INDUSTRIAL IMAGING CO., LTD.

Inventor： Jaeseon Kim ,  Kyunyeon Kim ,  Hyungbum Kim ,  Jongsu Lee ,  Youngjin Yi ,  Donghyeon Hwang

IPC: G01N21/57 ,  G01N21/27 ,  G01N21/25 ,  G01N21/95 ,  G01J3/50

Abstract: Various embodiments of the present invention relate to an apparatus and method for measuring the surface of an electronic device, the apparatus comprising: a seating portion on which the electronic device is seated; a first light source for irradiating first light on the surface of the electronic device; a first camera for photographing the surface using the first light; a second light source for irradiating second light on the surface of the electronic device; a second camera for photographing the surface using the second light; and an analyzer electronically connected to the first light source, the first camera, the second light source, and the second camera, wherein the analyzer is setup to analyze the color of the surface acquired using the first light source and the first camera; and the gloss of the surface acquired using the second light source and the second camera, so as to analyze the color and gloss of the surface of the electronic device using quantified and digitized data, thereby enabling quality inspection of the surface of the electronic device without deviation. Various other embodiments are possible.