公开(公告)号：US11862571B2

公开(公告)日：2024-01-02

申请号：US17693545

申请日：2022-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung-Gug Min ,  Younhee Kang ,  Min-Woo Song

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L23/552 ,  H01L23/498 ,  H01L25/00

Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.

公开(公告)号：US11011473B2

公开(公告)日：2021-05-18

申请号：US16519788

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younhee Kang ,  Byoung-Gug Min ,  Shi-Kyung Kim ,  Min-Woo Song ,  Jae-Seon Hwang

IPC: H01L23/29 ,  H01L21/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/00

Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.

公开(公告)号：US11508681B2

公开(公告)日：2022-11-22

申请号：US16988136

申请日：2020-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojae Park ,  Younhee Kang ,  Junghyun Roh

IPC: H01L23/00

Abstract: A semiconductor package includes a semiconductor substrate, a conductive pad on the semiconductor substrate, a redistribution line conductor, a coating insulator, and an aluminum oxide layer. The redistribution line conductor is electrically connected to the conductive pad. The coating insulator covers the redistribution line conductor and partially exposes the redistribution line conductor. The aluminum oxide layer is provided below the coating insulator and extends along a top surface of the redistribution line conductor, and the aluminum oxide layer is in contact with the redistribution line conductor.

公开(公告)号：US11296037B2

公开(公告)日：2022-04-05

申请号：US16668289

申请日：2019-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung-Gug Min ,  Younhee Kang ,  Min-Woo Song

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/00

Abstract: A semiconductor package including a first semiconductor chip having an upper surface, a lower surface that is opposite to the upper surface, and a sidewall between the upper surface and the lower surface; a capping insulation layer covering the upper surface and the sidewall of the first semiconductor chip; and a shielding layer on the capping insulation layer, wherein a lower portion of the capping insulation layer includes a laterally protruding capping protrusion contacting a lower surface of the shielding layer.

公开(公告)号：US20210043592A1

公开(公告)日：2021-02-11

申请号：US16988136

申请日：2020-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojae Park ,  Younhee Kang ,  Junghyun Roh

IPC: H01L23/00

Abstract: A semiconductor package includes a semiconductor substrate, a conductive pad on the semiconductor substrate, a redistribution line conductor, a coating insulator, and an aluminum oxide layer. The redistribution line conductor is electrically connected to the conductive pad. The coating insulator covers the redistribution line conductor and partially exposes the redistribution line conductor. The aluminum oxide layer is provided below the coating insulator and extends along a top surface of the redistribution line conductor, and the aluminum oxide layer is in contact with the redistribution line conductor.