公开(公告)号：US11342203B2

公开(公告)日：2022-05-24

申请号：US16739409

申请日：2020-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon Jeong ,  Mihyun Park ,  Yongsun Ko ,  Kwangwook Lee ,  Kuntack Lee ,  Hayoung Jeon ,  Yongjhin Cho ,  Jihoon Cha

IPC: H01L21/02 ,  H01L21/67

Abstract: A substrate cleaning apparatus includes a support inside a chamber to hold a substrate, a first supply source inside the chamber that includes a first nozzle along a first direction and facing an upper surface of the support, the first nozzle to spray polymer and solvent onto the substrate to form a coating, and a second nozzle at an oblique angle to the first direction and facing an edge of the support to inject a hot gas toward the coating to volatilize the solvent, a second supply source inside the chamber and having a third nozzle facing the upper surface of the support to inject a peeling treatment to the coating to peel the coating from the substrate, and a third supply source inside the chamber and facing a lower surface of the support to inject the hot gas to heat a second surface of the substrate.