公开(公告)号：US20200303314A1

公开(公告)日：2020-09-24

申请号：US16414016

申请日：2019-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam KANG ,  Yong Jin PARK ,  Young Gwan KO ,  Moon II KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.

公开(公告)号：US20190371731A1

公开(公告)日：2019-12-05

申请号：US16149102

申请日：2018-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam KANG ,  Jin Su KIM ,  Yong Jin PARK ,  Young Gwan KO ,  Yong Jin SEOL

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L23/367 ,  H01L23/31

Abstract: A semiconductor package includes a support member including a resin body having a first surface and a second surface opposing each other and having a cavity, and at least one passive component embedded in the resin body and having a connection terminal exposed from the first surface; a first connection member disposed on the first surface of the resin body, and having a first redistribution layer on the first insulating layer and connected to the connection terminal; a second connection member disposed on the first connection member and covering the cavity, and having a second redistribution layer on the second insulating layer and connected to the first redistribution layer; and a semiconductor chip disposed on the second connection member in the cavity.