公开(公告)号：US20190157237A1

公开(公告)日：2019-05-23

申请号：US16057323

申请日：2018-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Je LEE ,  Seunglo LEE ,  Sungil CHO ,  Hosoo HAN

IPC: H01L23/00

Abstract: A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a first ball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.

公开(公告)号：US20230230952A1

公开(公告)日：2023-07-20

申请号：US17959786

申请日：2022-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyeok HEO ,  Hyosung KOO ,  Munsoo PARK ,  Yong Je LEE

IPC: H01L23/00 ,  B23K9/28

CPC classification number: H01L24/78 ,  B23K9/28 ,  H01L2224/78611 ,  H01L2224/78631 ,  H01L2224/7825

Abstract: Disclosed are wire clamps and wire bonding apparatuses including the same. The wire clamp comprises a clamping lever, a driving lever parallel to the clamping lever and having an upper support, a shaft that penetrates a center of the driving lever to connect to the clamping lever, a spring in the driving lever and on an outer circumferential surface of the shaft, and an upper pivot that protrudes from an inner wall of the upper support to separate the upper support from the clamping lever. The driving lever has a load point and an effort point on opposite sides of the shaft. The effort point is connected in a direction of a straight line to the shaft and the effort point.