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公开(公告)号:US20180272669A1
公开(公告)日:2018-09-27
申请号:US15899804
申请日:2018-02-20
Applicant: Samsung Electronics Co., Ltd. , Daehyunst Co., Ltd.
Inventor: Younggyun KIM , Choontaek SHIM , Sangil HWANG , Jeeyoung OH , Hoyoung LEE , Jaeseon JEON , Jaehyeok HEO
CPC classification number: B32B27/08 , B32B7/12 , B32B17/10018 , B32B27/26 , B32B27/308 , B32B2255/10 , B32B2457/20 , C09J7/22 , C09J7/29 , C09J2203/318 , C09J2205/31 , C09J2433/006
Abstract: A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.
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公开(公告)号:US20230230952A1
公开(公告)日:2023-07-20
申请号:US17959786
申请日:2022-10-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyeok HEO , Hyosung KOO , Munsoo PARK , Yong Je LEE
CPC classification number: H01L24/78 , B23K9/28 , H01L2224/78611 , H01L2224/78631 , H01L2224/7825
Abstract: Disclosed are wire clamps and wire bonding apparatuses including the same. The wire clamp comprises a clamping lever, a driving lever parallel to the clamping lever and having an upper support, a shaft that penetrates a center of the driving lever to connect to the clamping lever, a spring in the driving lever and on an outer circumferential surface of the shaft, and an upper pivot that protrudes from an inner wall of the upper support to separate the upper support from the clamping lever. The driving lever has a load point and an effort point on opposite sides of the shaft. The effort point is connected in a direction of a straight line to the shaft and the effort point.
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