公开(公告)号：US20240173820A1

公开(公告)日：2024-05-30

申请号：US18214857

申请日：2023-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonsu Go ,  Donghoon Kwon

IPC: B24B53/12 ,  B24B1/04 ,  B24B53/017

CPC classification number: B24B53/12 ,  B24B1/04 ,  B24B53/017

Abstract: Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.