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公开(公告)号:US20230246143A1
公开(公告)日:2023-08-03
申请号:US18130570
申请日:2023-04-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seungryong HAN , Hyunsun KIM , Yangsoo SON , Jinhyun CHO , Jeongin HAN
CPC classification number: H01L33/58 , H01L25/167 , H01L24/29 , H01L24/83 , H01L2933/0058 , H01L24/32 , H01L2224/29028 , H01L2224/2919 , H01L2224/32145 , H01L2224/83203
Abstract: A display module includes a substrate; a thin film transistor (TFT) layer which is stacked on a front surface of the substrate; a plurality of light emitting diodes electrically connected to a plurality of TFT electrodes arranged on the TFT layer; an anti-reflection layer which is stacked on the TFT layer, has a light-absorbing color that absorbs external light, and fixes in place the plurality of light emitting diodes; and a protective layer stacked on the anti-reflection layer and the plurality of light emitting diodes. The plurality of TFT electrodes and the plurality of light emitting diodes are electrically connected to each other in the anti-reflection layer.
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公开(公告)号:US20230075390A1
公开(公告)日:2023-03-09
申请号:US17726673
申请日:2022-04-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yangsoo SON
IPC: H01L21/32 , H01L21/3105 , H01L21/47
Abstract: A method of fabricating a semiconductor device includes forming a cut-off region in at least one mandrel line among a plurality of mandrel lines, conformally forming a spacer material layer in the plurality of mandrel lines and a non-mandrel area and forming a cut spacer in the cut-off region and depositing a gap-fill material such that a cut block is formed on a portion of the non-mandrel area and a concave portion of the cut spacer is filled.
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