公开(公告)号：US11910516B2

公开(公告)日：2024-02-20

申请号：US17293280

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki Moon ,  Yoonsun Park ,  Seunghoon Kang ,  Kyungha Koo ,  Seyoung Jang ,  Woojune Jung

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/14 ,  H05K7/20336 ,  H05K2201/064 ,  H05K2201/10098

Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.