公开(公告)号：US20230238417A1

公开(公告)日：2023-07-27

申请号：US18127110

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14638

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

公开(公告)号：US20180145104A1

公开(公告)日：2018-05-24

申请号：US15636801

申请日：2017-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/1462 ,  H01L27/14636

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

公开(公告)号：US20210202563A1

公开(公告)日：2021-07-01

申请号：US17202702

申请日：2021-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.