公开(公告)号：US20180145104A1

公开(公告)日：2018-05-24

申请号：US15636801

申请日：2017-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/1462 ,  H01L27/14636

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

公开(公告)号：US20230238417A1

公开(公告)日：2023-07-27

申请号：US18127110

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14638

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

公开(公告)号：US20220102315A1

公开(公告)日：2022-03-31

申请号：US17547382

申请日：2021-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jang-woo LEE ,  Un-byoung KANG ,  Ji-hwang KIM ,  Jong-bo SHIM ,  Young-kun JEE

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chip, the interposer having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate, and an upper filling layer including a center portion and an outer portion, the center portion being between the first semiconductor chip and the interposer, and the outer portion surrounding the center portion and having a thickness greater than a thickness of the center portion in a direction perpendicular to the upper surface of the first package substrate.

公开(公告)号：US20210202563A1

公开(公告)日：2021-07-01

申请号：US17202702

申请日：2021-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-hwang KIM ,  Jong-bo SHIM ,  Sang-uk HAN ,  Cha-jea JO ,  Won-il LEE

IPC: H01L27/146

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.