公开(公告)号：US20250022772A1

公开(公告)日：2025-01-16

申请号：US18425010

申请日：2024-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insik HAN ,  Shle-Ge LEE ,  Junho LEE ,  WanSun KIM

IPC: H01L23/40 ,  H01L23/00 ,  H01L23/522 ,  H01L25/18 ,  H10B80/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate. A chip structure is on the package substrate. A stiffener covers the chip structure and the package substrate. Screws fix the stiffener to the package substrate. The stiffener includes a main portion that covers an upper surface of the chip structure. A vertical portion that covers lateral side surfaces of the chip structure. The vertical portion extends from an end of the main portion. An edge portion extending laterally from the vertical portion and covering the upper surface of the package substrate. The screws penetrate the edge portion and the package substrate and couple the edge portion to the package substrate.