公开(公告)号：US11508780B2

公开(公告)日：2022-11-22

申请号：US16926169

申请日：2020-07-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Takashi Takagi ,  Masaru Wada ,  Satoshi Yanagisawa ,  Tsubasa Fujiwara

IPC分类号： H01L27/15 ,  G09F9/33

摘要： A method of manufacturing a display apparatus, a display apparatus, and a structure for manufacturing a display apparatus are provided. The method of manufacturing a display apparatus includes: forming a micro-light-emitting diode (LED) chip on a relay substrate such that a chip-side electrode is exposed; transferring the micro-LED chip from the relay substrate to a driving substrate including a driving substrate-side electrode; and bonding the chip-side electrode to the driving substrate-side electrode.

公开(公告)号：US10727373B2

公开(公告)日：2020-07-28

申请号：US16072793

申请日：2017-01-17

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yoshihiro Yokote ,  Katsutoshi Sasaki ,  Dai Aoki ,  Tsubasa Fujiwara ,  Atsushi Sato

IPC分类号： H01L33/36 ,  H01L33/56 ,  H01L33/54 ,  H01L23/31 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  G09G3/32

摘要： Provided are a light emitting diode capable of improving contrast, a method for manufacturing a light emitting diode, a light emitting diode display device, and a method for manufacturing a light emitting diode display device. The light emitting diode according to an embodiment comprises a package substrate having an electrode provided therein; a light emitting diode chip provided on the package substrate; a power line electrically connecting the light emitting diode chip to the electrode; and a black layer covering the electrode including a part connected to the power line.