公开(公告)号：US11476394B2

公开(公告)日：2022-10-18

申请号：US17136470

申请日：2020-12-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dai Aoki

IPC: H01L33/50 ,  H01L33/60 ,  H01L27/15

Abstract: Disclosed herein is a light emitting device and a display apparatus capable of improving design freedom. A package is provided with light extraction regions LR, LG, and LB and a partition region D provided on an outside of the light extraction regions LR, LG, and LB. The package includes an LED provided in the light extraction regions LR, LG, and LB and configured to emit light of a predetermined wavelength range and wavelength conversion layers 13R, 13G and 13B provided in the light extraction regions LR, LG, and LB and configured to convert the wavelength of light emitted from the LED. The package includes a wall portion provided in the partition region D and a first laminated portion provided in the partition region D and including a material different from a material forming the wall portion.

公开(公告)号：US10727373B2

公开(公告)日：2020-07-28

申请号：US16072793

申请日：2017-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoshihiro Yokote ,  Katsutoshi Sasaki ,  Dai Aoki ,  Tsubasa Fujiwara ,  Atsushi Sato

IPC: H01L33/36 ,  H01L33/56 ,  H01L33/54 ,  H01L23/31 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  G09G3/32

Abstract: Provided are a light emitting diode capable of improving contrast, a method for manufacturing a light emitting diode, a light emitting diode display device, and a method for manufacturing a light emitting diode display device. The light emitting diode according to an embodiment comprises a package substrate having an electrode provided therein; a light emitting diode chip provided on the package substrate; a power line electrically connecting the light emitting diode chip to the electrode; and a black layer covering the electrode including a part connected to the power line.