公开(公告)号：US20140289776A1

公开(公告)日：2014-09-25

申请号：US14298814

申请日：2014-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Chan Kang ,  Taehee Kim ,  Paul Kim

IPC: H04N21/482 ,  H04N21/462

CPC classification number: H04N21/482 ,  H04N7/015 ,  H04N7/025 ,  H04N21/44008 ,  H04N21/4432 ,  H04N21/4622 ,  H04N21/4826

Abstract: A system and method for automatically managing television channel lists is disclosed. Pixel resolutions characteristics of a plurality of televisions channels are analyzed. One or more high definition television (HDTV) channels having HD pixel resolutions from the plurality of available television channels are selected. The one or more selected HDTV channels are stored in a HD channel list.

Abstract translation: 公开了一种用于自动管理电视频道列表的系统和方法。 分析多个电视频道的像素分辨率特征。 选择具有来自多个可用电视频道的HD像素分辨率的一个或多个高分辨率电视（HDTV）频道。 一个或多个选择的HDTV频道被存储在HD频道列表中。

公开(公告)号：US20250087706A1

公开(公告)日：2025-03-13

申请号：US18433653

申请日：2024-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myungjin Lee ,  Hyunbum Kang ,  Taehee Kim ,  Jusik Kim ,  Gaehwang Lee

IPC: H01M4/66 ,  H01M4/02 ,  H01M4/131 ,  H01M4/133 ,  H01M10/0525 ,  H01M10/0562 ,  H01M10/42

Abstract: An all-solid-state secondary battery includes: a positive electrode layer including a positive electrode active material layer, and a positive electrode current collector; a negative electrode layer including a negative electrode current collector, and a negative electrode active material layer; a solid electrolyte layer; and an elastomeric member including an elastomer and disposed inside the negative electrode current collector or the positive electrode current collector, wherein the negative electrode current collector and the negative electrode active material layer are disposed side by side in a thickness direction of the negative electrode layer, the positive electrode current collector and the positive electrode active material layer are disposed side by side in a thickness direction of the positive electrode layer, and the negative electrode current collector or the positive electrode current collector surrounds an outer surface of the elastomeric member.

公开(公告)号：US20240387463A1

公开(公告)日：2024-11-21

申请号：US18614964

申请日：2024-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonggi Jin ,  Gyuho Kang ,  Unbyoung Kang ,  Taehee Kim ,  Hyungjun Park

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

Abstract: A semiconductor package includes a semiconductor device including a substrate, bonding pads provided on a front surface of the substrate and bump structures provided on the bonding pads respectively, each of the bump structures having a metal pillar and a metal paste coated on one end portion of the metal pillar; and a wiring layer including a metal wiring layer having redistribution pads and a protective layer on the metal wiring layer and having recesses that expose at least portions of the redistribution pads. The semiconductor device is stacked on the wiring layer via the bump structures. Portions of the bump structures are respectively disposed in the recesses of the protective layer, and the metal pastes are respectively bonded to the redistribution pads.