公开(公告)号：US20230024260A1

公开(公告)日：2023-01-26

申请号：US17958813

申请日：2022-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dooseok CHOI ,  Youngki LEE ,  Sunwoo LEE ,  Thomas Byunghak CHO

IPC: H01Q9/04 ,  G06K19/077 ,  H01Q1/22 ,  H01Q5/28 ,  H01Q5/40

Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.

公开(公告)号：US20220376406A1

公开(公告)日：2022-11-24

申请号：US17881219

申请日：2022-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki LEE ,  Sunwoo LEE ,  Dooseok CHOI

IPC: H01Q21/06 ,  H01Q5/35 ,  H01Q5/48

Abstract: An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.

公开(公告)号：US20210313708A1

公开(公告)日：2021-10-07

申请号：US17038883

申请日：2020-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki LEE ,  Sunwoo LEE ,  Dooseok CHOI

IPC: H01Q21/06 ,  H01Q5/35

Abstract: An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.

公开(公告)号：US20240072446A1

公开(公告)日：2024-02-29

申请号：US18387276

申请日：2023-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki LEE ,  Sunwoo LEE ,  Dooseok CHOI ,  Seungchan HEO

IPC: H01Q9/04 ,  H01Q1/38

CPC classification number: H01Q9/045 ,  H01Q1/38 ,  H01Q9/0414

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

公开(公告)号：US20220302592A1

公开(公告)日：2022-09-22

申请号：US17833378

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki LEE ,  Sunwoo LEE ,  Dooseok CHOI ,  Seungchan HEO

IPC: H01Q9/04 ,  H01Q1/38

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.