公开(公告)号：US20250140695A1

公开(公告)日：2025-05-01

申请号：US18927458

申请日：2024-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunggu KANG ,  Jaechoon KIM ,  Sungho MUN

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a first redistribution layer substrate having a lower conductive structure; a first semiconductor chip and a second semiconductor chip electrically connected to the first redistribution layer substrate and arranged side-by-side on the first redistribution layer substrate; and an interposer disposed over a portion of the first semiconductor chip and a portion of the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip, wherein the first semiconductor chip comprises a rear power distribution network structure in a lower portion of the first semiconductor chip, and the second semiconductor chip comprises a rear power distribution network structure in a lower portion of the second semiconductor chip.