公开(公告)号：US20240321618A1

公开(公告)日：2024-09-26

申请号：US18610612

申请日：2024-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suhwan SHIM ,  Sungchul KIM ,  Sangho JANG ,  Youngshin CHOI

IPC: H01L21/68 ,  H01L21/66 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683

CPC classification number: H01L21/681 ,  H01L21/67259 ,  H01L21/67333 ,  H01L21/6838 ,  H01L22/20

Abstract: A semiconductor manufacturing apparatus includes a semiconductor package. A tray has the semiconductor package seated thereon. An inspector inspects an alignment state of the semiconductor package. A protrusion is on a top surface of the tray and extends in a Z direction that is a vertical direction. The protrusion surrounds a side surface of the semiconductor package when the semiconductor package is in an aligned state. The semiconductor package overlaps at least a portion of the protrusion in the Z direction when the semiconductor package is in a misaligned state. An under vision camera detects a rotation angle of the semiconductor package with respect to an X-Y plane defined in a first horizontal direction X and a second horizontal direction Y that cross the Z direction. A picker moves the semiconductor package between the tray and an area above the under vision camera.