公开(公告)号：US12105027B2

公开(公告)日：2024-10-01

申请号：US17684052

申请日：2022-03-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jang Ryul Park ,  Soon Yang Kwon ,  Kwang Rak Kim ,  Myung Jun Lee ,  Sung Ho Jang

IPC: G01N21/95 ,  G02B7/00 ,  G01N21/88 ,  G02B3/00

CPC classification number: G01N21/9501 ,  G02B7/005 ,  G01N2021/8845 ,  G02B2003/0093

Abstract: A method for fabricating a semiconductor device is provided. The method includes: loading a substrate on a stage of an apparatus for inspecting the substrate; extracting a first light having a first wavelength from a light by using a light source; acquiring first position information on at least one focal point, formed on the substrate, based on the first wavelength by using a controller, the at least one focal point being a pre-calculated at least one focal point; adjusting a position of at least one from among an objective lens and at least one microsphere in a vertical direction by using the first position information in the controller; condensing the first light, which has passed through the at least one microsphere, on the at least one focal point formed on the substrate; and inspecting the substrate by using the first light condensed on the at least one focal point.