公开(公告)号：US20240203946A1

公开(公告)日：2024-06-20

申请号：US18537997

申请日：2023-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junyeong HEO ,  Unbyoung KANG ,  Sera LEE ,  Jihoon JUNG

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/00 ,  H01L23/48 ,  H01L29/06

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L23/481 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L29/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06565 ,  H01L2225/06568

Abstract: A semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. A semiconductor device layer is disposed on the active surface. A modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.