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公开(公告)号:US20190051728A1
公开(公告)日:2019-02-14
申请号:US16156062
申请日:2018-10-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung Han LEE , Myung Il KANG , Jae Hwan LEE , Sun Wook KIM , Seong Ju KIM , Sung Jin PARK , Hong Seon YANG , Joo Hee JUNG
IPC: H01L29/423 , H01L29/78 , H01L29/66 , H01L29/49
Abstract: A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.
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公开(公告)号:US20180130890A1
公开(公告)日:2018-05-10
申请号:US15596152
申请日:2017-05-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung Han LEE , Myung Il KANG , Jae Hwan LEE , Sun Wook KIM , Seong Ju KIM , Sung Jin PARK , Hong Seon YANG , Joo Hee JUNG
IPC: H01L29/423 , H01L29/78 , H01L29/66 , H01L29/49
CPC classification number: H01L29/4236 , H01L29/4966 , H01L29/6656 , H01L29/66795 , H01L29/7855
Abstract: A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.
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