公开(公告)号：US10938090B2

公开(公告)日：2021-03-02

申请号：US16287056

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Mi Jung ,  Seong Hyun Yoo ,  Ji Hye Shim ,  Ki Seok Kim

IPC: G06K19/06 ,  H01Q1/22 ,  H01Q1/24 ,  G06K19/077 ,  H01L23/66

Abstract: An antenna module includes: a base substrate including a rigid region and a flexible region; an antenna member disposed on one surface of the rigid region of the base substrate and including antenna patterns; and a semiconductor package disposed on the other surface of the rigid region of the base substrate and including one or more semiconductor chips.