公开(公告)号：US11430679B2

公开(公告)日：2022-08-30

申请号：US16821415

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangnam Kim ,  Nohsung Kwak ,  Sungyeon Kim ,  Hyungjun Kim ,  Haejoong Park ,  Jongwoo Sun ,  Sangrok Oh ,  Ilyoung Han ,  Jungpyo Hong

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.