公开(公告)号：US20190341353A1

公开(公告)日：2019-11-07

申请号：US16105942

申请日：2018-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mi Ja HAN ,  Dae Hyun PARK ,  Seong Hwan LEE ,  Sang Jong LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/16

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes. The electromagnetic wave shielding layer includes a first region and a second region in which densities of the degassing holes are different from each other, the first region having a density of the degassing holes higher than a density of the degassing holes in the second region.

公开(公告)号：US20200219783A1

公开(公告)日：2020-07-09

申请号：US16821305

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han KIM ,  Jae Hyun LIM ,  Yoon Seok SEO ,  Sang Jong LEE

IPC: H01L23/367 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.

公开(公告)号：US20190273030A1

公开(公告)日：2019-09-05

申请号：US16110436

申请日：2018-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun LIM ,  Han KIM ,  Yoon Seok SEO ,  Sang Jong LEE

IPC: H01L23/367 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.