公开(公告)号：US20140327148A1

公开(公告)日：2014-11-06

申请号：US14259200

申请日：2014-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： So-Young LIM ,  Na-Rae SHIN ,  Jeong-Kyu HA ,  Kyoung-Suk YANG ,  Pa-Lan LEE

IPC: H01L23/48

CPC classification number: H01L23/49541 ,  H01L23/00 ,  H01L23/4824 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16225 ,  H05K1/118

Abstract: A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs.

Abstract translation: 膜芯片（COF）封装包括薄膜基板，第一引线在薄膜基板的第一表面上，第一引线具有第一长度，第二引线在薄膜基板的第一表面上，第二引线具有第二引线 长度大于第一长度，首先通过插入薄膜基板并连接到第一引线的第一端的插塞，以及穿过薄膜基片并连接到第二引线的第一端的第二通孔塞，第二表面上的第一连接引线 所述第一连接引线具有连接到所述第一通孔的第一端和所述薄膜基板的第二表面上的第二连接引线，所述第二连接引线具有电连接到所述第二通孔塞 。