公开(公告)号：US10942216B2

公开(公告)日：2021-03-09

申请号：US15958387

申请日：2018-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Yeol Kim ,  Jae-Hong Kim ,  Kyung-Min Lee ,  Mee-Hyun Lim

IPC: G01R31/28 ,  G01N21/95 ,  G01R1/07 ,  G02F1/13 ,  G01N21/88

Abstract: An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.

公开(公告)号：US11047901B2

公开(公告)日：2021-06-29

申请号：US16437675

申请日：2019-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mee-Hyun Lim ,  Sung-Yeol Kim ,  Seong-Keun Cho ,  Won-Don Joo ,  Jae-Hong Kim ,  Taek-Jin Kim ,  Kyung-Min Lee ,  Sang-Min Lee

IPC: G01R31/26 ,  G01N21/21 ,  G01R1/07 ,  G01R31/308

Abstract: In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.

公开(公告)号：US20190113565A1

公开(公告)日：2019-04-18

申请号：US15958387

申请日：2018-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Yeol Kim ,  Jae-Hong Kim ,  Kyung-Min Lee ,  Mee-Hyun Lim

IPC: G01R31/28 ,  G01N21/95 ,  G01N21/88 ,  G02F1/13 ,  G01R1/07

Abstract: An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.