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公开(公告)号：US11538701B2
公开(公告)日：2022-12-27
申请号：US16791564
申请日：2020-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taehyoung Lee , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC: H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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公开(公告)号：US12205040B2
公开(公告)日：2025-01-21
申请号：US17245173
申请日：2021-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsung Bae , Seungho Gwak , Kwangrak Kim , Seunggun Byoun , Gilwoo Song , Younghoon Shin , Kyungwon Yun , Chiyoung Lee , Taeyong Jo
Abstract: A method of manufacturing a semiconductor device includes forming a pattern on a wafer, measuring a spectrum of the pattern on the wafer, with a spectral optical system, performing an analysis of the spectrum through a deep learning model for predicting pattern characteristics, the deep learning model being trained based on a domain knowledge, and evaluating the pattern on the wafer based on the analysis of the spectrum, wherein the domain knowledge includes a noise inducing factor of the spectral optical system.
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Patent Agency Ranking
公开(公告)号：US20210164919A1
公开(公告)日：2021-06-03
申请号：US17022249
申请日：2020-09-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwon Yun , Taewan Kim , Seungbeom Park , Jaehyeon Son , Myungjun Lee , Jaehwang Jung
IPC: G01N21/956 , G01N21/45
Abstract: An inspection apparatus includes: a light source that generates and outputs light; a stage on which an inspection target is arranged; an irradiation optical system that irradiates light from the light source to the inspection target; a detector that receives the light diffracted from the inspection target and generates diffraction image; and a detector moving device configured to move the detector on a z-axis, which is an optical axis of the light, and an x-y plane perpendicular to the z-axis. Furthermore, while the detector moves on the x-y plane and the z-axis through the detector moving device, the detector generates a plurality of the diffraction images with different positions on the x-y plane and the z-axis with respect to the inspection target, and thus simultaneously implements phase retrieval and super resolution of diffraction images.
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公开(公告)号：US11275034B2
公开(公告)日：2022-03-15
申请号：US17022249
申请日：2020-09-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwon Yun , Taewan Kim , Seungbeom Park , Jaehyeon Son , Myungjun Lee , Jaehwang Jung
IPC: G01N21/956 , G01N21/45
Abstract: An inspection apparatus includes: a light source that generates and outputs light; a stage on which an inspection target is arranged; an irradiation optical system that irradiates light from the light source to the inspection target; a detector that receives the light diffracted from the inspection target and generates diffraction image; and a detector moving device configured to move the detector on a z-axis, which is an optical axis of the light, and an x-y plane perpendicular to the z-axis. Furthermore, while the detector moves on the x-y plane and the z-axis through the detector moving device, the detector generates a plurality of the diffraction images with different positions on the x-y plane and the z-axis with respect to the inspection target, and thus simultaneously implements phase retrieval and super resolution of diffraction images.
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公开(公告)号：US11428947B2
公开(公告)日：2022-08-30
申请号：US16848169
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Myungjun Lee , Seungbeom Park , Jaehyeon Son , Jaehwang Jung , Taewan Kim , Kyungwon Yun
Abstract: A super-resolution holographic microscope includes a light source configured to emit input light, a diffraction grating configured to split the input light into first diffracted light and second diffracted light, a mirror configured to reflect the first diffracted light, a wafer stage arranged on an optical path of the second diffracted light and on which a wafer is configured to be arranged, and a camera configured to receive the first diffracted light that is reflected by the mirror and the second diffracted light that is reflected by the wafer to generate a plurality of hologram images of the wafer.
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公开(公告)号：US20210080743A1
公开(公告)日：2021-03-18
申请号：US16848169
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Myungjun LEE , Seungbeom Park , Jaehyeon Son , Jaehwang Jung , Taewan Kim , Kyungwon Yun
Abstract: Provided is a super-resolution holographic microscope including a light source configured to emit input light, a diffraction grating configured to split the input light into first diffracted light and second diffracted light, a mirror configured to reflect the first diffracted light, a wafer stage arranged on an optical path of the second diffracted light and on which a wafer is configured to be arranged, and a camera configured to receive the first diffracted light that is reflected by the mirror and the second diffracted light that is reflected by the wafer to generate a plurality of hologram images of the wafer.
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公开(公告)号：US20210013074A1
公开(公告)日：2021-01-14
申请号：US16791564
申请日：2020-02-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： TAEHYOUNG LEE , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC: H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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