公开(公告)号：US20220352173A1

公开(公告)日：2022-11-03

申请号：US17558728

申请日：2021-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongjun LEE ,  Kyungsun RYU ,  Dongjun LEE ,  Jin-Seong LEE

IPC: H01L27/108

Abstract: A semiconductor device includes bit lines extending in a first direction on a substrate, a lower contact connected to the substrate between two adjacent ones of the bit lines, a landing pad on the lower contact, and an insulating structure surrounding a sidewall of the landing pad, the insulating structure including a first insulating pattern having a top surface at a lower level than a top surface of the landing pad, and a second insulating pattern on the top surface of the first insulating pattern.

公开(公告)号：US20220165736A1

公开(公告)日：2022-05-26

申请号：US17368053

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungsun RYU ,  Duckhee LEE ,  Junwon LEE ,  Younseok CHOI

IPC: H01L27/108

Abstract: A semiconductor device includes an active pattern on a substrate, a gate structure buried at an upper portion of the active pattern, a bit line structure on the active pattern, a spacer structure on a sidewall of the bit line structure, a contact plug structure contacting the spacer structure, an insulating interlayer structure partially penetrating through upper portions of the contact plug structure, the spacer structure and the bit line structure, and a capacitor on the contact plug structure. The spacer structure includes an air spacer including air. The insulating interlayer structure includes first and second insulating interlayers. The second insulating interlayer may include an insulation material different from that of the first insulating interlayer. A lower surface of the second insulating interlayer covers a top of the air spacer, and a lowermost surface of the first insulating interlayer is covered by the second insulating interlayer.