公开(公告)号：US20210351103A1

公开(公告)日：2021-11-11

申请号：US17238734

申请日：2021-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hwa LEE ,  Kyung Duk LEE

IPC: H01L23/38 ,  G11C7/04 ,  G11C5/14 ,  H01L25/065

Abstract: Provided is a semiconductor package. The semiconductor package comprises a semiconductor chip on a substrate, a voltage measurement circuit configured to measure an external voltage to be input into the semiconductor chip and a thermoelectric module configured to convert heat released from the semiconductor chip into an auxiliary power, and configured to apply the auxiliary power to the semiconductor chip, the thermoelectric module being separated from the voltage measurement circuit, wherein the voltage measurement circuit is configured to control the thermoelectric module to apply the auxiliary power to the semiconductor chip in response to a change in the external voltage.

公开(公告)号：US20220179724A1

公开(公告)日：2022-06-09

申请号：US17376441

申请日：2021-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Seop SHIM ,  Kyung Duk LEE ,  Jong-Sung NA ,  Chan Moo PARK ,  In Kap CHANG ,  Chang Min CHO

IPC: G06F11/00 ,  G06F17/18 ,  G06N20/00

Abstract: A method for operating a storage device capable of improving reliability of a memory system is provided. The method includes providing a storage device which includes a first component and a second component; receiving, via a host interface of the storage device, a command for requesting failure possibility information about the storage device from an external device; and providing, via the host interface, the failure possibility information about the storage device to the external device in response to the command.