公开(公告)号：US10510737B2

公开(公告)日：2019-12-17

申请号：US15786698

申请日：2017-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

公开(公告)号：US11600608B2

公开(公告)日：2023-03-07

申请号：US17204225

申请日：2021-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

公开(公告)号：US10985152B2

公开(公告)日：2021-04-20

申请号：US16503121

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.