公开(公告)号：US11749592B2

公开(公告)日：2023-09-05

申请号：US17348936

申请日：2021-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donguk Kwon ,  Jiwon Shin ,  Kwangbok Woo ,  Minseung Ji

IPC: H01L23/498 ,  H01L23/32 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49833 ,  H01L23/3121 ,  H01L23/32 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058

Abstract: A lower semiconductor package of a package-on-package type semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a chip connecting terminal disposed between the semiconductor chip and the package substrate and configured to connect the semiconductor chip to the package substrate; conductive pillars arranged on the package substrate to at least partially surround the semiconductor chip; and a dam structure configured to cover the conductive pillars on the package substrate and having a first opening at least partially surrounding the semiconductor chip.