公开(公告)号：US20240429174A1

公开(公告)日：2024-12-26

申请号：US18750274

申请日：2024-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jing Cheng LIN ,  Kwangbae KIM ,  Hyunchul JUNG ,  Youngkun JEE

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package according to an embodiment includes a first semiconductor chip, a second semiconductor chip, a first dielectric film surrounding the first semiconductor chip and the second semiconductor chip; first vias; second vias; a bridge chip; a second dielectric film surrounding the bridge chip and having an upper surface and a lower surface opposite to the upper surface; and a third via, some of the first vias are electrically connected to some of the bridge chip pads, some of the second vias are electrically connected to others of the bridge chip pads, and the passivation layer includes a same material as a material of the first dielectric film.