公开(公告)号：US09599663B2

公开(公告)日：2017-03-21

申请号：US14085945

申请日：2013-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Boo Kang ,  Ki-Sub Lim

IPC: G01R21/00 ,  G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.