公开(公告)号：US20210407962A1

公开(公告)日：2021-12-30

申请号：US17154789

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongwon KIM ,  Junmo KOO ,  Yeonjoo KIM ,  Yunhee KIM ,  Jongkook KIM ,  Doohwan LEE ,  Jeongho LEE

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips disposed on the interposer package, the interposer package includes a first redistribution layer, a bridge chip including a bridge circuit, and a vertical connection structure including a plurality of wiring layers, and wherein each of the first semiconductor chip and the second semiconductor chip is electrically connected to the bridge circuit and the plurality of wiring layers through the first redistribution layer.