公开(公告)号：US10672727B2

公开(公告)日：2020-06-02

申请号：US16108202

申请日：2018-08-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Joon Kim ,  Jung Ho Shim ,  Jun Young Won ,  Han Kim

IPC: H01L23/64 ,  H01L23/552 ,  H01L23/12 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538

Abstract: A semiconductor package includes a support member having first and second surfaces opposing each other, having first and second through-holes, spaced apart from each other, and having a wiring structure that connects the first and second surfaces to each other; a connection member disposed on the second surface of the support member and having redistribution layers connected to the wiring structure; a semiconductor chip disposed in the first through-hole and having connection pads connected to the redistribution layers; a second passive component disposed in the second through-hole and connected to the redistribution layers; a first encapsulant disposed on the first surface of the support member and encapsulating the first passive component; and a second encapsulant encapsulating the support member, the first encapsulant, and the semiconductor chip.