公开(公告)号：US20240170308A1

公开(公告)日：2024-05-23

申请号：US18215258

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joohee KIM ,  Youngjae JEON ,  Jaehyun CHO ,  Yihwan KIM

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67017 ,  H01J37/3171

Abstract: An apparatus for preheating a substrate includes a preheating chamber, a cooling plate, a heater, an isolation plate, a gas supplier and a gas discharger. The preheating chamber may be configured to receive the substrate. The cooling plate may be arranged on an upper surface of the preheating chamber. The heater may be arranged between the cooling plate and the substrate to heat the substrate. The isolation plate may be arranged between the cooling plate and the substrate to form a first space between the preheating chamber and the isolation plate and a second space between the cooling plate and the isolation plate. The gas supplier may be configured to individually supply a vent gas to the first space and the second space. The gas discharge may be configured to individually supply vacuum to the first space and the second space.

公开(公告)号：US20240068748A1

公开(公告)日：2024-02-29

申请号：US18204459

申请日：2023-06-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joohee KIM ,  Youngjae JEON ,  Jaehyun CHO ,  Yihwan KIM ,  Sangmin LEE

IPC: F27B17/00 ,  H05B3/00

CPC classification number: F27B17/0025 ,  H05B3/0047

Abstract: A wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. The heating lamp may be configured to heat a wafer. The heating lamp may include a plurality of lamps. Each of the plurality of lamps may have circular band shapes with open regions. At least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.

公开(公告)号：US20210028052A1

公开(公告)日：2021-01-28

申请号：US16846792

申请日：2020-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinho SO ,  Keonwoo KIM ,  Joohee KIM ,  Minsung KIM ,  Eultae KIM ,  Bora YOON

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/68 ,  H01J37/32

Abstract: A substrate processing apparatus and a lift pin alignment apparatus, the substrate processing apparatus including a chamber; a substrate plate on which the substrate is seatable; a plurality of movable lift in the substrate plate to support the substrate; a leveling sensor configured to be loadable in the chamber on the lift pins; a controller configured to receive measurement values of roll (φ) and pitch (θ) of a plane of the lift pins to calculate a rotation matrix (T) of the plane from the measurement values of roll (φ) and pitch (θ), and to calculate travel distances of the lift pins for leveling the plane to be parallel with a horizontal reference plane by using the rotation matrix (T) and to output a lift pin control signal for aligning the lift pins; and a lift pin driver to move the lift pins according to the lift pin control signal.