公开(公告)号：US11670623B2

公开(公告)日：2023-06-06

申请号：US17155260

申请日：2021-01-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam Kang ,  Sang Kyu Lee ,  Jin Gu Kim ,  Yong Koon Lee

IPC: H01L25/10 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L25/50 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A semiconductor package is provided. The semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a heat sink structure comprising a lower heat sink pattern disposed on the first semiconductor chip, a metal film pattern disposed on the lower heat sink pattern, and an insulating film disposed on side walls of the lower heat sink pattern and side walls of the metal film pattern, an interposer disposed on the heat sink structure, and a solder ball which connects the heat sink structure and the interposer.

公开(公告)号：US11515265B2

公开(公告)日：2022-11-29

申请号：US16934889

申请日：2020-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.

公开(公告)号：US10748856B2

公开(公告)日：2020-08-18

申请号：US16103199

申请日：2018-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.

公开(公告)号：US20220005793A1

公开(公告)日：2022-01-06

申请号：US17155260

申请日：2021-01-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam KANG ,  Sang Kyu Lee ,  Jin Gu Kim ,  Yong Koon Lee

IPC: H01L25/10 ,  H01L25/00

Abstract: A semiconductor package is provided. The semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a heat sink structure comprising a lower heat sink pattern disposed on the first semiconductor chip, a metal film pattern disposed on the lower heat sink pattern, and an insulating film disposed on side walls of the lower heat sink pattern and side walls of the metal film pattern, an interposer disposed on the heat sink structure, and a solder ball which connects the heat sink structure and the interposer.

公开(公告)号：US20200350262A1

公开(公告)日：2020-11-05

申请号：US16934889

申请日：2020-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Hee Moon ,  Myung Sam Kang ,  Jin Gu Kim

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.