公开(公告)号：US12088002B2

公开(公告)日：2024-09-10

申请号：US17976597

申请日：2022-10-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jigu Jang ,  Hoyoung Lee

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H04M1/026 ,  H01Q1/48

Abstract: An electronic device, according to an embodiment of the present disclosure, may comprise: a front plate; a rear plate positioned on an opposite side of the front plate; a side member including a side surface surrounding at least a part of a space between the front plate and the rear plate, and including a non-conductive material; a non-conductive member comprising a non-conductive material positioned in the space alongside the side member; an adhesive positioned between the side member and the non-conductive member; at least one antenna positioned in the space and spaced apart from the side member and having the non-conductive member therebetween, the at least one antenna is coupled to the non-conductive member; and a communication circuit configured to transmit and/or receive a signal in a selected or designated frequency band by means of the at least one antenna.