公开(公告)号：US20240203693A1

公开(公告)日：2024-06-20

申请号：US18532468

申请日：2023-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hee Won MIN ,  Song Yun KANG ,  Ju Ho KIM ,  Seok Hwan BAE ,  Dong Yun YEO ,  Kui Hyun YOON ,  Seung Bin LIM ,  Ji Yun JU ,  Seo Yeon CHOI

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32642 ,  H01J37/32715 ,  H01J2237/006 ,  H01J2237/334

Abstract: A plasma processing equipment includes: an electrostatic chuck on which a substrate is provided; a gas filling unit provided between the substrate and the electrostatic chuck; a gas supply unit extending through the electrostatic chuck and connected to the gas filling unit, the gas supply unit comprising a plurality of first nonconductive balls; and a focus ring provided along an edge of the electrostatic chuck.