公开(公告)号：US20230052006A1

公开(公告)日：2023-02-16

申请号：US17703264

申请日：2022-03-24

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji Hoon JEONG ,  Young-Hoo Kim ,  Sang Jine Park ,  Ji Hwan Park

IPC分类号： G03F7/32 ,  H01L21/67 ,  H01L21/027

摘要： An apparatus for processing a substrate includes a process chamber; a support which is placed inside the process chamber and supports the substrate; a fluid supplier which supplies fluid into the process chamber; and a controller configured to perform a compressing step to bring the fluid into a supercritical phase inside the process chamber, in which the compressing step includes a continuous first section and second section, the fluid supplier includes a first portion and a second portion, and the controller supplies the fluid into the process chamber at a first speed during the first section using the first portion, and supplies the fluid into the process chamber at a second speed higher than the first speed during the second section using the second portion.