公开(公告)号：US20250069861A1

公开(公告)日：2025-02-27

申请号：US18440554

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myeongsoo Shin ,  Donghyeon Na ,  Kyung-Sun Kim ,  Jaebin Kim ,  Myoung Soo Park ,  Jong In Park ,  Seungbo Shim ,  Jimo Lee ,  Woongjin Cheon

IPC: H01J37/32

Abstract: A magnetic element assembly includes a magnetic member having a circular ring shape or an arc shape, and at least one focusing member made of a ferromagnetic material, connected to the magnetic member, and configured to adjust distribution of a magnetic force in a peripheral space, where the at least one focusing member includes a connection portion connected to the magnetic member and at least one focusing portion extending downward from the connection portion.

公开(公告)号：US20240038505A1

公开(公告)日：2024-02-01

申请号：US18295466

申请日：2023-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghyeon Na ,  Jaebin Kim ,  Myeongsoo Shin ,  Dongseok Han ,  Kyungsun Kim ,  Namkyun Kim ,  Jaesung Kim ,  Seungbo Shim

IPC: H01J37/32 ,  H01J37/20

CPC classification number: H01J37/3266 ,  H01J37/20 ,  H01J37/32532

Abstract: A plasma processing apparatus includes a wafer support fixture in the chamber and configured to support a wafer, an upper electrode in the chamber and spaced apart from the wafter support fixture, a magnet assembly configured to apply a magnetic field into a chamber, the magnet assembly including a plurality of first magnets and a plurality of second magnets arranged in an annular shape, and a horizontal distance from a central axis of the chamber to each of the plurality of first magnets and each of the plurality of second magnets is less than a radius of the wafer.