公开(公告)号：US20230126102A1

公开(公告)日：2023-04-27

申请号：US17876240

申请日：2022-07-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNCHUL KIM ,  YONGHYUN KIM ,  SEUNGHWAN BAEK ,  MINJAE LEE ,  JUHYUNG LEE

IPC: H01L23/498 ,  H01L25/10

Abstract: A semiconductor package structure includes a semiconductor chip on a package substrate; a lower connection bump on the package substrate; and an interposer substrate on the lower connection bump on the package substrate and an upper surface of the semiconductor chip. The semiconductor package structure includes an upper connection bump on a lower surface of the interposer substrate; and a support structure on a lower surface of the interposer substrate, spaced apart from the upper connection bump to provide support between the package substrate and the interposer substrate. The upper connection bump and the lower connection bump constitute a connection bump structure, and the support structure includes a metal core ball and a ball cover layer surrounding the metal core ball, wherein the ball cover layer is formed to gradually decrease in thickness in a direction from the interposer substrate to the package substrate cross-section.

公开(公告)号：US20210375773A1

公开(公告)日：2021-12-02

申请号：US17130170

申请日：2020-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUHYUNG LEE ,  Seok Geun Ahn ,  Sunchul Kim

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/373 ,  H01L23/31 ,  H01L23/13 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: A semiconductor package includes a first substrate including a first recess formed in a top surface of the first substrate, a first semiconductor chip disposed in the first recess and mounted on the first substrate, an interposer substrate disposed on the first semiconductor chip and including a second recess formed in a bottom surface of the interposer substrate, an adhesive layer disposed in the second recess and in contact with a top surface of the first semiconductor chip, a plurality of connection terminals spaced apart from the first recess and connecting the first substrate to the interposer substrate, and a molding layer disposed between the first substrate and the interposer substrate.