公开(公告)号：US20230005723A1

公开(公告)日：2023-01-05

申请号：US17709613

申请日：2022-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGDO KIM ,  SUNGYONG LIM ,  DAEWON KANG ,  SUNGYEOL KIM ,  SANGKI NAM ,  MYUNGGEUN SONG ,  BYUNGKOOK CHO ,  HYEONCHEOL JIN ,  JONGHUN PI

IPC: H01J37/32

Abstract: A semiconductor processing system includes: a semiconductor processing chamber including an electrostatic chuck disposed in a chamber housing, and a first power supplier for supplying first radio frequency (RF) power to an internal electrode disposed in the electrostatic chuck; a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal; and a control device for outputting an interlock control signal to the semiconductor processing chamber, when it is determined that the voltage increases to be within a predetermined reference range based on the digital signal. The electrostatic chuck is configured to enable a wafer to be seated on a surface of the electrostatic chuck.

公开(公告)号：US20230096455A1

公开(公告)日：2023-03-30

申请号：US17704676

申请日：2022-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEUNGCHUL LEE ,  DONGIL KIM ,  HYUNJOON PARK ,  KIJU SOHN ,  JONGHUN PI

IPC: B24B57/02 ,  H01L21/306

Abstract: A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The slurry distribution part includes; a guide bar including a slot extending in a first direction, a distribution bar inserted into the slot and including a distribution channel extending in the first direction, the distribution channel being recessed upwardly from a bottom surface of the distribution bar, and a slurry delivery member configured to deliver slurry to the distribution channel.