公开(公告)号：US20240145437A1

公开(公告)日：2024-05-02

申请号：US18409778

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI-HWAN HWANG ,  SANG-SICK PARK ,  TAE-HONG MIN ,  GEOL NAM

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L25/0657 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L23/3128 ,  H01L2225/06586

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US20210280564A1

公开(公告)日：2021-09-09

申请号：US17329036

申请日：2021-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI-HWAN HWANG ,  SANG-SICK PARK ,  TAE-HONG MIN ,  GEOL NAM

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US20230207533A1

公开(公告)日：2023-06-29

申请号：US18182246

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI-HWAN HWANG ,  SANG-SICK PARK ,  TAE-HONG MIN ,  GEOL NAM

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/0655 ,  H01L25/105 ,  H01L24/73 ,  H01L24/32 ,  H01L24/92 ,  H01L24/17 ,  H01L25/50 ,  H01L2225/06586 ,  H01L23/3128

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US20170243857A1

公开(公告)日：2017-08-24

申请号：US15439321

申请日：2017-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI-HWAN HWANG ,  SANG-SICK PARK ,  TAE-HONG MIN ,  GEOL NAM

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.