公开(公告)号：US20240222147A1

公开(公告)日：2024-07-04

申请号：US18404333

申请日：2024-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minseock CHANG ,  Kunho KWAK ,  Kibong ROH ,  Sangyong LEE ,  Jinyoung LEE ,  Kyungjin LIM ,  Jaehong KWON ,  Inki HONG

IPC: H01L21/67 ,  B65B11/58 ,  B65B51/00 ,  B65B57/00

CPC classification number: H01L21/67 ,  B65B11/58 ,  B65B51/00 ,  B65B57/00

Abstract: A method of transporting a semiconductor is provided and includes: providing an accommodation container accommodating a wafer and including nitrogen gas to a packaging chamber; performing, in the packaging chamber, a first packaging on the accommodation container by packaging the accommodation container with vinyl; performing a second packaging on the accommodation container, on which the first packaging has been performed, by packaging the accommodation container with a logistics bag; transporting the accommodation container to a standby chamber and standing by the accommodation container in the standby chamber; and transporting the accommodation container that was in standby in the standby chamber by using a transporter in the transport chamber. A temperature of the standby chamber, in which the accommodation container is in standby, is maintained in a range of 18° C. to 23.5° C., and a humidity of the standby chamber is maintained in a range of 0% to 45%.