公开(公告)号：US20250022842A1

公开(公告)日：2025-01-16

申请号：US18748254

申请日：2024-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilbok Lee ,  Sungeun Kim ,  Younglyong Kim

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H10B80/00

Abstract: A semiconductor package includes a package substrate, a sub-package arranged on the package substrate, an underfill material layer arranged between the package substrate and the sub-package, a dam structure spaced apart from the sub-package, on the package substrate, and extending to surround the underfill material layer, and an ejection prevention barrier arranged on one side of the sub-package, on the package substrate, and spaced apart from the sub-package in a first horizontal direction with the dam structure therebetween, wherein a top surface of the dam structure has a first vertical level, and a top surface of the ejection prevention barrier has a second vertical level higher than the first vertical level.