公开(公告)号：US20240387234A1

公开(公告)日：2024-11-21

申请号：US18621273

申请日：2024-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUNHYUNG KIM ,  INSEOK SEO

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/683

Abstract: A substrate support apparatus includes a base plate disposed in a space for performing a semiconductor process, a substrate stage disposed apart from the base plate, the substrate stage having a seating surface on an upper surface of the substrate stage, and a plurality of support structures arranged in a circumferential direction on the base plate to support the substrate stage on the base plate, the plurality of support structures extending in a radial direction to have a predetermined inclination angle from a surface of the base plate.

公开(公告)号：US20240100639A1

公开(公告)日：2024-03-28

申请号：US18233374

申请日：2023-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： INSEOK SEO ,  MINSUNG KIM ,  DASOM LEE ,  HEEWON MIN ,  DONGYUN YEO

IPC: B23Q3/15

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. Movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.