公开(公告)号：US20240100639A1

公开(公告)日：2024-03-28

申请号：US18233374

申请日：2023-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： INSEOK SEO ,  MINSUNG KIM ,  DASOM LEE ,  HEEWON MIN ,  DONGYUN YEO

IPC: B23Q3/15

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. Movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.