公开(公告)号：US12125687B2

公开(公告)日：2024-10-22

申请号：US17709613

申请日：2022-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngdo Kim ,  Sungyong Lim ,  Daewon Kang ,  Sungyeol Kim ,  Sangki Nam ,  Myunggeun Song ,  Byungkook Cho ,  Hyeoncheol Jin ,  Jonghun Pi

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32715 ,  H01J37/32183 ,  H01J37/32935 ,  H01J2237/24564 ,  H01J2237/3341 ,  H01L21/6833

Abstract: A semiconductor processing system includes: a semiconductor processing chamber including an electrostatic chuck disposed in a chamber housing, and a first power supplier for supplying first radio frequency (RF) power to an internal electrode disposed in the electrostatic chuck; a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal; and a control device for outputting an interlock control signal to the semiconductor processing chamber, when it is determined that the voltage increases to be within a predetermined reference range based on the digital signal. The electrostatic chuck is configured to enable a wafer to be seated on a surface of the electrostatic chuck.