公开(公告)号：US10679957B2

公开(公告)日：2020-06-09

申请号：US16140252

申请日：2018-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-Ho Shin ,  Bonhwi Gu ,  Hyekyeong Kweon ,  Sungjin Kim ,  Joodong Kim ,  Jaepil Lee ,  Dongwon Lim

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/66 ,  H01L23/522 ,  H01L23/535 ,  H01L23/532

Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower insulating layer of the edge region and arranged at first intervals in a first direction, an upper insulating layer covering the connection structures, and a plurality of redistribution pads disposed on the upper insulating layer and connected to the connection structures, respectively. Each of the redistribution pads includes a pad portion provided on the chip region. The pad portions of the redistribution pads are spaced apart from the connection structures by a first distance in a second direction intersecting the first direction when viewed in a plan view.

公开(公告)号：US10854562B2

公开(公告)日：2020-12-01

申请号：US16867634

申请日：2020-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-Ho Shin ,  Bonhwi Gu ,  Hyekyeong Kweon ,  Sungjin Kim ,  Joodong Kim ,  Jaepil Lee ,  Dongwon Lim

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/532 ,  H01L23/535 ,  H01L23/522 ,  H01L21/66

Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower insulating layer of the edge region and arranged at first intervals in a first direction, an upper insulating layer covering the connection structures, and a plurality of redistribution pads disposed on the upper insulating layer and connected to the connection structures, respectively. Each of the redistribution pads includes a pad portion provided on the chip region. The pad portions of the redistribution pads are spaced apart from the connection structures by a first distance in a second direction intersecting the first direction when viewed in a plan view.